Recent Patents and Applications for MEMS

by KNOWLES ELECTRONICS LLC on August 10, 2017 at 12:00 pm

The present disclosure relates generally to microphones and related components. One example micro electro mechanical system (MEMS) motor includes a first diaphragm; a second diaphragm that is disposed in generally parallel relation to the first diaphragm, the first diaphragm and second diaphragm […]

by KNOWLES ELECTRONICS LLC on August 10, 2017 at 12:00 pm

The present disclosure generally relates to acoustic assemblies. One acoustic assembly includes a base and a first die disposed on the base. The first die comprises a microelectromechanical system (MEMS) microphone that includes a first diaphragm and a first back plate. The MEMS microphone has a […]

by GLOBALFOUNDRIES SINGAPORE PTE LTD on August 10, 2017 at 12:00 pm

Three-axis monolithic microelectromechanical system (MEMS) accelerometers and methods for fabricating integrated capacitive and piezo accelerometers are provided. In an embodiment, a three-axis MEMS accelerometer includes a first sensing structure for sensing acceleration in a first direction. […]

by BOSCH GMBH ROBERT on August 10, 2017 at 12:00 pm

Die Erfindung schafft eine MEMS-Lautsprechervorrichtung sowie ein entsprechendes Herstellungsverfahren. Die MEMS-Lautsprechervorrichtung umfasst ein erstes Substrat (S1) mit einer ersten Vorderseite (VS1) und einer ersten Rueckseite (RS1), welches eine erste Rueckseitenkaverne (K1) aufweist, die […]

by X CELEPRINT LTD on August 10, 2017 at 12:00 pm

A compound sensor device includes a semiconductor substrate having an active electronic circuit formed in or on the semiconductor substrate. A sensor comprising a sensor substrate including a sensor circuit having an environmental sensor or actuator formed in or on the sensor substrate is […]

by SHARP KK ; SHARP LABORATORIES OF AMERICA INC on August 10, 2017 at 12:00 pm

A bi-stable micro-electrical mechanical system (MEMS) heat harvester is provided. A bi-stable MEMS cantilever located between a hot temperature surface and a cold temperature surface, and is made up of a first MEMS material layer, having a first coefficient of thermal expansion. A second MEMS […]

by KING ABDULLAH UNIV OF SCIENCE AND TECHNOLOGY on August 10, 2017 at 12:00 pm

Deep reactive ion etching is essential for creating high aspect ratio micro-structures for microelectromechanical systems, sensors and actuators, and emerging flexible electronics. A novel hybrid dual soft/hard mask bilayer may be deposited during semiconductor manufacturing for deep reactive […]

by STMICROELECTRONICS INC on August 10, 2017 at 12:00 pm

Disclosed herein is a device including a MEMS sensor configured to generate a first differential capacitance representing a change in capacitance from a first original sensing capacitance value and a second differential capacitance representing a change in capacitance from a second original sensing […]

by ANALOG DEVICES GLOBAL on August 10, 2017 at 12:00 pm

Microelectromechanical systems (MEMS) switches are described. The MEMS switches can be actively opened and closed. The switch can include a beam coupled to an anchor on a substrate by one or more hinges. The beam, the hinges and the anchor may be made of the same material in some configurations. […]

by TAIWAN SEMICONDUCTOR MFG CO LTD on August 10, 2017 at 12:00 pm

A method for fusion bonding a pair of substrates together with silane preconditioning is provided. A surface of a first oxide layer or a surface of a second oxide layer is preconditioned with silane. The first and second oxide layers are respectively arranged on first and second semiconductor […]